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Description
Nov 24, 2015 specifications for the XC7Z010, XA7Z010, XC7Z015,. XC7Z020 , XA7Z020, and XQ7Z020, complements the. Zynq-7000 AP SoC documentation Mar 1, 2016 In Table 5-1, updated thermal resistance data for the XC7Z010 and XC7Z020 devices. Updated Appendix B, Heat Sink Guidelines for Lidless Mar 23, 2012 XC7Z020 . XC7Z030. XC7Z035. XC7Z045. XC7Z100. Processin g. System. Processor Core. Dual-core ARM Cortex -A9 MPCore with Nov 24, 2015 DS191 (v1.17) November 24, 2015 www.xilinx.com. Product Specification. 1. Copyright 2012 2015 Xilinx, Inc. Xilinx, the Xilinx logo, Zynq, Sep 4, 2015 The Zynq-7000 XC7Z020 AP SoC, page 13 description for callout 1 available on the XC7Z020 AP SoC was changed to There are four PL
| Part Number | XC7Z0201CLG484I |
| Main Category | Integrated Circuits (ICs) |
| Sub Category | Embedded - System On Chip (SoC) |
| Brand | Renesas |
| Description | IC SOC CORTEX-A9 ARTIX-7 484BGA |
| Series | Zynq-7000 |
| Packaging | Tray |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM Cortex-A9 MPCore,with CoreSight,,-" |
| MCU Flash | 256KB |
| MCU RAM | DMA |
| Peripherals | CAN, EBI/EMI, Ethernet, I²ÂC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Connectivity | 667MHz |
| Speed | Artix,7 FPGA, 85K Logic Cells |
| Primary Attributes | -40°C ~ 100°C (TJ) |
| Operating Temperature | 484-LFBGA, CSPBGA |
| Package / Case | 484-CSPBGA (19x19) |
| Supplier Device Package | |
| Image |  |
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