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Description
Datasheet Apr 1, 2010 Ultra small Resin Package (URP) is suitable for surface mount design. Ordering Information. Type No. Laser Mark. Package Code. HVU316 . N. 2010 4 1 Rev.7.00 2005.02.24 page 1 of 4. HVU316 . . BS/CS . RJJ03G0424-0700. HVU316 Spice parameter. * Model generated on Sep 24, 96. * MODEL FORMAT: HITACHI SPICE. * HITACHI DIODE Model . MODEL HVU316 ZDV D. URP. 5. HVU300C. URP. 5. HVU306B. URP. 5. HVU306C. URP. 5. HVU307. URP. 5. HVU316 . URP. 5. HVU326C. URP. 5. HVU327C. URP. 5. HVU328C. URP. What gives rise to this sort of encounter? Non-MOS. Low-voltage MOS. High- voltage MOS. Power Device. Element power density. Package current capacity and
| Part Number | HVU316 |
| Brand | Renesas |
| Image |  |
HVU316
RENRSAS
2070
0.77
Quantum Chip technology Co., Limited
HVU316
rene
120000
1.81
HK Great Sunny Co., Limited
HVU316
ren
41000
2.85
N&S Electronic Co., Limited
HVU316 / N
RENESA
15600
3.89
Ande Electronics Co., Limited
HVU316
RENESAS/NEC
50000
4.93
Yestard Electronics Co,.Ltd.
