(5/5) based on 5 customer reviews
Description
IC MCU 32BIT 256KB FLASH 80LQFP Series: V850ES/Jx3-L Core Processor: V850ES Core Size: 32-Bit Speed: 20MHz Connectivity: CSI, EBI/EMI, I2C, UART/USART Peripherals: DMA, LVD, PWM, WDT Number of I/O: 66 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40～C ~ 85～C Package / Case: 80-LQFP Supplier Device Package: *
| Part Number | UPD70F3736GC-GAD-AX |
| Main Category | Integrated Circuits (ICs) |
| Sub Category | Embedded - Microcontrollers |
| Brand | Renesas |
| Description | IC MCU 32BIT 256KB FLASH 80LQFP |
| Series | V850ES/Jx3-L |
| Packaging | Tray |
| Core Processor | V850ES |
| Core Size | 32-Bit |
| Speed | 20MHz |
| Connectivity | CSI, EBI/EMI, I²ÂC, UART/USART |
| Peripherals | DMA, LVD, PWM, WDT |
| Number of I/O | 66 |
| Program Memory Size | 256KB (256K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 16K x 8 |
| Voltage - Supply (Vcc/Vdd) | 2.2 V ~ 3.6 V |
| Data Converters | A/D 8x10b, D/A 1x8b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package / Case | 80-LQFP |
| Supplier Device Package | - |
| Image |  |
UPD70F3736GC-GAD-AX
RENRSAS
600
0.89
HK HEQING ELECTRONICS LIMITED
UPD70F3736GC-GAD-AX
rene
8636
2.1475
MLC Europe B.V.
UPD70F3736GC-GAD-AX
ren
605
3.405
Pujia Electronics Technology Co., Limited
UPD70F3736GC-GAD-AX
RENESA
37500
4.6625
Cinty Int'l (HK) Industry Co., Limited
UPD70F3736GC-GAD-AX
RENESAS/NEC
13000
5.92
CIS Ltd (CHECK IC SOLUTION LIMITED)
