(5/5) based on 3 customer reviews
Description
IC MCU 32BIT 16KB FLASH 64LFQFP Series: V850ES/Jx3-H Core Processor: V850ES Core Size: 32-Bit Speed: 48MHz Connectivity: CAN, CSI, EBI/EMI, I2C, UART/USART, USB Peripherals: DMA, LVD, PWM, WDT Number of I/O: 45 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.85 V ~ 3.6 V Data Converters: A/D 10x10b; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40～C ~ 85～C Package / Case: 48-WFQFN Exposed Pad Supplier Device Package: *
| Part Number | UPD70F3820GB-GAH-AX |
| Main Category | Integrated Circuits (ICs) |
| Sub Category | Embedded - Microcontrollers |
| Brand | Renesas |
| Description | IC MCU 32BIT 16KB FLASH 64LFQFP |
| Series | V850ES/Jx3-H |
| Packaging | Tray |
| Core Processor | V850ES |
| Core Size | 32-Bit |
| Speed | 48MHz |
| Connectivity | CAN, CSI, EBI/EMI, I²ÂC, UART/USART, USB |
| Peripherals | DMA, LVD, PWM, WDT |
| Number of I/O | 45 |
| Program Memory Size | 16KB (16K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 8K x 8 |
| Voltage - Supply (Vcc/Vdd) | 2.85 V ~ 3.6 V |
| Data Converters | A/D 10x10b; D/A 1x8b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package / Case | 48-WFQFN Exposed Pad |
| Supplier Device Package | - |
| Image |  |
UPD70F3820GB-GAH-AX
RENRSAS
600
1.75
HK HEQING ELECTRONICS LIMITED
UPD70F3820GB-GAH-AX
rene
37500
2.815
Cinty Int'l (HK) Industry Co., Limited
UPD70F3820GB-GAH-AX
ren
9450
3.88
ONSTAR ELECTRONICS CO., LIMITED
UPD70F3820GB-GAH-AX
RENESA
3000
4.945
HONG KONG YUE JIN PENG ELECTRONICS CO.
UPD70F3820GB-GAH-AX
RENESAS/NEC
15000
6.01
HongKong JDG Electronic Co., Limited
