Part Number | XC7Z035-2FBG676E |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | Renesas |
Description | IC SOC CORTEX-A9 KINTEX7 676BGA |
Series | Zynq-7000 |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore,with CoreSight,,-" |
MCU Flash | 256KB |
MCU RAM | DMA |
Peripherals | CAN, EBI/EMI, Ethernet, I²ÂC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Connectivity | 800MHz |
Speed | Kintex,7 FPGA, 275K Logic Cells |
Primary Attributes | 0°C ~ 100°C (TJ) |
Operating Temperature | 676-BBGA, FCBGA |
Package / Case | 676-FCBGA (27x27) |
Supplier Device Package | |
Image |
Hot Offer
XC7Z035-2FBG676E
RENESA
7412
2.1775
Zhongke Shendian Semiconductor (Shenzhen) Group Co., Ltd.
XC7Z035-2FBG676E
RENESAS/NEC
6197
2.89
Hong Kong New RD Core Electronics Co., Limited
XC7Z035-2FBG676E
RENRSAS
4193
0.04
HITO TECHNOLOGY LIMITED
XC7Z035-2FBG676E
rene
6727
0.7525
Shenzhen Haoxinsheng Technology Co., Ltd.
XC7Z035-2FBG676E
ren
1519
1.465
Top Electronics Co.,